| PART |
Description |
Maker |
| 411-18235 0-744003-5 |
This ERGOCRIMP Die is suitable to crimp the following crimp contacts
|
TE Connectivity Ltd
|
| 411-18527 5-0744014-7 |
This ERGOCRIMP Die is suitable to crimp the following crimp contacts
|
TE Connectivity Ltd
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| FP0 FP0-A80 FP0-XXX |
Suitable
|
ETC
|
| SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 4A die sawn
Diodes - HV Chips - 600V, 4A die unsawn
|
Infineon
|
| STD3NA50 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP5N30 STP5N30FI |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STP40NE03L-20 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
| STD9N10 |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
|
ST Microelectronics
|
