| PART |
Description |
Maker |
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0901200776 90120-0776 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0705419075-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419041-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0705419042-17 |
2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded
|
Molex Electronics Ltd.
|
| 0022122221 A-4094-22A501 22-12-2221 |
2.54mm (.100) Pitch KK? Wire-to-Board Header, Single Row, Right Angle, 22 Circuits, PA Polyamide Nylon, Gold (Au) Plating
2.54mm (.100) Pitch KK庐 Wire-to-Board Header, Single Row, Right Angle, 22 Circuits, PA Polyamide Nylon, Gold (Au) Plating
2.54mm (.100) Pitch KK垄莽 Wire-to-Board Header, Single Row, Right Angle, 22 Circuits, PA Polyamide Nylon, Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0705750081 |
2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .180 Pocket, Shrouded,with Press-fit Plastic Peg, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin
2.54mm (.100") Pitch SL垄芒 Header, Single Row, Right Angle, .180" Pocket, Shrouded,with Press-fit Plastic Peg, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective P
|
Molex Electronics Ltd.
|
| 90627-0145 0906270145 SDA-90627 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail, 25
|
Molex Electronics Ltd.
|
| 0879370406 87937-0406 |
2.54mm (.100) Pitch KK庐 Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
2.54mm (.100) Pitch KK? Header, Single Row Dual Body, Through Hole, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 11.00mm (.433) Stacking Height
|
Molex Electronics Ltd.
|
| 0901200131 90120-0131 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 11 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 11 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901200132 90120-0132 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 12 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 0901210147 |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, 27 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
|
