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XFWCMC321619-121 - TAPE AND PACKAGING FOR HIGH VOLUME MANUFACTURING

XFWCMC321619-121_8960575.PDF Datasheet


 Full text search : TAPE AND PACKAGING FOR HIGH VOLUME MANUFACTURING
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PART Description Maker
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High Voltage, high performance Class D audio aplifier driver with PWM modulator and protection in a 16-Lead SOIC Narrow Package; Similar to IRS2092PBF Shipped on Tape and Reel
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Advanced Micro Devices, Inc.
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ITT, Corp.
KA558D2 KA558B KA558BD KA558 KA558_KA558B Tantalum Molded High Reliability Capacitor; Capacitance: 68uF; Voltage: 6.3V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel
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From old datasheet system
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
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PanJit International Inc.
PANJIT[Pan Jit International Inc.]
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Coto Technology
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55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU2405 with Lead Free Packaging
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VISAY[Vishay Siliconix]
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Wolfson Microelectronics plc
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   Tape and Reel Packaging
Analog Devices
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Wurth Elektronik GmbH & Co. KG, Germany.
 
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