| PART |
Description |
Maker |
| 540-88-032-17-400-TR |
PGA / BGA / PLCC SOCKETS
|
Precid-Dip Durtal SA
|
| PLCC44AG PLCC44AT PLCC84AG PLCC84AT PLCC100AG PLCC |
PLCC SOCKETS
|
Adam Technologies, Inc.
|
| PLCC-44 |
Surface Mount PLCC Sockets
|
Framatome Connectors International
|
| 5210815-1 |
PGA Sockets; PGA223P18 TIN STD/.25AU OFNS ( Tyco Electronics )
|
Tyco Electronics
|
| 504-99-084-24-000 504-99-068-24-000 |
Sockets for Plastic Leaded Chip Carriers (PLCC) Solder tail
|
Precid-Dip Durtal
|
| 68-304538-10 68-304538-10-P |
PLCC68-PGA68, IC SOCKET
68-Pin PLCC w/Die Flipped-to-68-Pin PGA for 87C196 IC and Others
|
ARIES ELECTRONICS INC
Aries Electronics, Inc.
|
| 24005 |
Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, μBGA and Bumped Die Devices
|
Aries Electronics, Inc.
|
| PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-02 |
15NS, 68 PLCC, IND TEMP(EPLD)
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
15NS, 68 PLCC, COM TEMP(EPLD)
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
20NS, 44 PLCC, IND TEMP(EPLD)
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA)
15NS, TQFP, COM TEMP, ROHS-A(EPLD)
20NS, 44 TQFP, COM TEMP(EPLD)
7NS, 44 TQFP, COM TEMP, GREEN(EPLD)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
|
Intel, Corp.
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| PUMA67E4007AM-25 PUMA67E4007AM-25E PUMA67E4007-20 |
x32 EEPROM Module
150NS, TSOP, IND TEMP(EEPROM)
150NS, PDIP, IND TEMP(EEPROM)
150NS, FLATPACK, 883C; LEV B CMPLNT(EEPROM)
150NS, PLCC, COM TEMP(EEPROM)
200NS, FLATPACK, 883C; LEV B COMPLIANT(EEPROM)
150NS, 44LCC, 883C; LEV B COMPLIANT(EEPROM)
350NS,PGA,883C; LEVEL B FULLY COMPLIANT(EEPROM)
150NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
250NS, 32LCC, 883C; LEV B COMPLIANT(EEPROM)
250NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM)
250NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
120NS, PGA, 883C; LEV B FULLY COMPLIANT(EEPROM)
150NS, PLCC, AUTO TEMP(EEPROM) X32号的EEPROM模块
150NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块
200NS, CERDIP, 883C; LEV B COMPLIANT(EEPROM) X32号的EEPROM模块
DIE(EEPROM) X32号的EEPROM模块
200NS, PDIP, IND TEMP(EEPROM)
|
Microtips Technology, Inc.
Amphenol, Corp.
TE Connectivity, Ltd.
|
|
