| PART |
Description |
Maker |
| BC7-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| PR010002 PR010003 PP040001 PP050002 PP040002 PRO50 |
MAT PRFRNCE 1.5X0.9 CHA/GRY
MAT PRFRNCE 1.8X1.2 CHR/GRY
MAT POLYPLUSH 0.9X0.6 GRN 垫POLYPLUSH 0.9X0.6 GRN
MAT POLYPLUSH 1.5X0.9 BRWN 垫POLYPLUSH 1.5X0.9 BRWN
MAT POLYPLUSH 1.5X0.9 GRN 垫POLYPLUSH 1.5X0.9 GRN
MAT PRFRNCE 1.5X0.9 BRWN 垫PRFRNCE 1.5X0.9 BRWN
MAT PRFRNCE 1.5X0.9 BLUE 垫PRFRNCE 1.5X0.9
|
YEONHO Electronics Co., Ltd.
Central Semiconductor, Corp.
Vishay Intertechnology, Inc.
|
| 71609-302ALF 71609-340ALF 71609-802ALF 71609-402AL |
60 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT, RECEPTACLE
HOUSIN MAT: THERMOPLASTIC GLASS FILLED
BtB RECEPT. HORIZ DR SMT
|
FCI connector
|
| DCR1020SF65 DCR1020SF DCR1020SF60 DCR1020SF61 DCR1 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
Phase Control Thyristor
|
DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
|
| Q65111A1648 |
Compact light source in SMT technology, glass window on top, RoHS compliant
|
OSRAM GmbH
|
| ML87V3116 |
DOT MAT LCD DSPL CTLR, PQFP176
|
OKI ELECTRIC INDUSTRY CO LTD
|
| 33482-0601 |
MX150 2X3 BLADE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
| 33471-0328 |
MX150 1X3 RECEPTACLE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
| PIC18F2685-I/ML PIC18LF2685-I/SO PIC18F2685-I/P PI |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| PIC18F248009 PIC18F4480-E_ML PIC18LF4480-E_ML PIC1 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| ML9041-XXBCVWA |
17 X 100 DOTS DOT MAT LCD DRVR AND DSPL CTLR, UUC175
|
LAPIS SEMICONDUCTOR CO LTD
|
