| PART |
Description |
Maker |
| AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement)
8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices
SPANSION[SPANSION]
|
| IXFK44N50F IXFX44N50F |
HiPerRF Power MOSFETs F-Class MegaHertz Switching Single MOSFET Die 44 A, 500 V, 0.12 ohm, N-CHANNEL, Si, POWER, MOSFET
FILM/M CAPACITANCE=4.7 VOLT=100
HiPerRF Power MOSFETs F-Class MegaHertz Switching Single MOSFET Die
|
IXYS, Corp.
ETC[ETC]
IXYS[IXYS Corporation]
|
| SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
|
Infineon
|
| MURC1060 |
MURC1060 Ultrafast Silicon Die
MURC1060 Ultrafast Silicon Die
|
SENSITRON[Sensitron]
|
| MURC520 |
MURC520 Ultrafast Silicon Die
MURC520 Ultrafast Silicon Die
|
Sensitron
|
| IXFN340N07 IXFN340N0704 |
HiPerFET?/a> Power MOSFETs Single Die MOSFET
HiPerFET⑩ Power MOSFETs Single Die MOSFET
HiPerFET Power MOSFETs Single Die MOSFET
|
IXYS Corporation
|
| PUMA2U8002I-25 PUMA2U8002I-20 PUMA2U8002M-15 PUMA2 |
DIE SALE, 1.8V,11MIL(SERIAL EE)
x32 EPROM Module
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
8-TSSOP, PB/HALO FREE,NiPdAu, 1.8V(SERIAL EE)
8 TSSOP, PB/HALO FREE, IND TEMP, 1.8V(SERIAL EE) X32号存储器模块
8-SAP,PB/HALO FREE,IND TEMP,2.7V(SERIAL EE) X32号存储器模块
|
NXP Semiconductors N.V.
Amphenol, Corp.
|
| 0011-40-2216 T63300A 11402216 0011402216 |
Terminator Die
|
Molex Electronics Ltd.
|
| 0011-40-2217 T63301A 0011402217 |
Terminator Die
|
Molex Electronics Ltd.
|
| 0011-40-2249 001140-2249 T63319A 0011402249 |
Terminator Die
|
Molex Electronics Ltd.
|
| 5SMY12H1200 |
IGBT-Die
|
The ABB Group
|
