| PART |
Description |
Maker |
| ADC12DJ3200ZEG ADC12DJ3200-19 |
<font color=red>[Old version datasheet]</font> 6.4-GSPS Single Channel or 3.2-GSPS Dual Channel, 12-bit, RF-Sampling Analog-to-Digital Converter (ADC)
|
TI store
|
| AT84AS008 |
10-Bit 2.2 Gsps ADC
|
Atmel
|
| JTS8388B-1V1B JTS8388B-1V2B TS8388B TS8388BCF TS83 |
ADC 8-bit 1 GSPS
|
ATMEL[ATMEL Corporation]
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| TS81102G0FS TTS81102G0VFS TTS81102G0MFS9C1 TTS8110 |
1:4/8 8-/10-bit 2 Gsps DMUX in CQFP package
DMUX 1:4/1:8 8/10-bit 2 Gsps.
DMUX 1:4/1:8 8/10-bit 2 Gsps. ESA/SCC9000 screening. Non ESA/SCC qualified.
|
Atmel
|
| K4H510438B-UC/LA2 K4H510838B-UC/LA2 K4H510438B-UC/ |
8-Bit, 31 kSPS ADC Serial Out, Microprocessor Peripheral/Standalone, Single Channels 8-PDIP 512MB的乙芯片DDR SDRAM内存规格
8-Bit, 31 kSPS ADC Serial Out, Microprocessor Peripheral/Standalone, Single Channels 8-SOIC
8-Bit, 22 kSPS ADC Serial Out, uProcessor Periph./Standalone, Mux option w/SE or differential, 2 Ch. 8-SOIC
8-Bit, 392 kSPS ADC Parallel Out, Microprocessor Peripheral, On-Chip Track-and-Hold, Single Channels 20-SSOP 0 to 70
512Mb B-die DDR SDRAM Specification
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
http://
|
| JTSX8388B-1V1B JTS8388B-1V1B |
1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, UUC46 DIE
1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, UUC46 2.44 X 3 MM, DIE-46
|
E2V Technologies PLC
Atmel, Corp.
Xilinx, Inc.
|
| HFA04SD60S |
Hexfred Die in Wafer Form
|
International Rectifier
|
| FD075H06A5 |
Fred Die in Wafer Form
|
International Rectifier
|
| FD200H02A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| HF50A060ACE |
Hexfred Die in Wafer Form
|
International Rectifier
|
| IRG4CC72KB |
IRG4CC72KB IGBT Die in Wafer Form
|
International Rectifier
|
