| PART |
Description |
Maker |
| VJ1825A103JXEAT VJ1825A123FXAAT VJ1825A153JXAAT VJ |
MULTILAYER CERAMIC CHIP CAPACITOR
CAP 0.012UF 50VDC C0G 1% SMD 1825 - Tape and Reel
CAP 0.015UF 50VDC C0G 5% SMD 1825 - Tape and Reel
Cap Ceramic 0.022uF 50V C0G 1% SMD 1825 150C Plastic T/R
CAP 0.022UF 50VDC C0G 5% SMD 1825 - Tape and Reel
CAP 0.01UF 50VDC C0G 2% SMD 1825 - Tape and Reel
VJ Hi-Rel Series Surface Mount Multilayer Ceramic Chip Capacitors for High Reliability Applications
CAPACITOR, CERAMIC, 50 V, C0G, 0.01 uF, SURFACE MOUNT, 1825, CHIP
|
Vishay Vitramon
|
| L-0603M0R10GWBS L-0805M2R00FBT0 L-1206M1R00FBT0 L- |
RES THNFLM 0603 0.1 OHM 2% 1/8W 300PPM MLD SMD - Bulk
RES THNFLM 0805 2 OHM 1% 1/5W 300PPM MLD SMD - Tape and Reel
RES THNFLM 1206 1 OHM 1% 1/3W 300PPM MLD SMD - Tape and Reel
RES THNFLM 2010 1 OHM 1% 1W 300PPM MLD SMD - Tape and Reel
|
Vishay Dale
|
| SOT616-1-115 |
HVQFN24 Reel pack SMD, 13 Q1/T1 Standard product orientation Orderable part number ending ,115 or J Ordering code (12NC) ending 115
|
NXP Semiconductors
|
| SOT109-1-118 |
SO16 Reel pack; SMD, 13 Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118
|
NXP Semiconductors
|
| SOT96-1-118 |
SO8 Reel pack; SMD, 13 Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118
|
NXP Semiconductors
|
| CY2X013FLXCT CY2X013FLXIT CY2X013LXCXXXT CY2X013LX |
6-Pin Ceramic LCC SMD - Tape and Reel
|
Cypress Semiconductor
|
| CY2XF32FLXCT CY2XF32FLXIT CY2XF32LXCXXXT CY2XF32LX |
6-Pin Ceramic LCC SMD - Tape and Reel
|
Cypress Semiconductor
|
| PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging
Analog IC
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging.
500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging
400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002
-100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging
-100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC
Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
|
TE Connectivity, Ltd.
|
| 1N540006 1N5408RLG 1N5400 1N5400G 1N5400RL 1N5400R |
3A 800V Standard Recovery Rectifier; Package: Axial Lead 9.50x5.30mm, 25.4x1.20mm Pkg, Lead len/dia; No of Pins: 2; Container: Tape and Reel; Qty per Container: 1200 3 A, 800 V, SILICON, RECTIFIER DIODE
3A 100V Standard Recovery Rectifier; Package: Axial Lead 9.50x5.30mm, 25.4x1.20mm Pkg, Lead len/dia; No of Pins: 2; Container: Tape and Reel; Qty per Container: 1200 3 A, 100 V, SILICON, RECTIFIER DIODE
3A 1000V Standard Recovery Rectifier; Package: Axial Lead 9.50x5.30mm, 25.4x1.20mm Pkg, Lead len/dia; No of Pins: 2; Container: Tape and Reel; Qty per Container: 1200 3 A, 1000 V, SILICON, RECTIFIER DIODE
Axial−Lead Standard Recovery Rectifiers
|
ONSEMI[ON Semiconductor]
|
| AG-16080AFT AG-16080AGA AG-16080AGI AG-16080AGU AG |
3.3 V Triple 3-input NAND gate
Power LDMOS transistor, SOT502B (LDMOST), Reel Pack, SMD, 13"
Quad 2-input NOR gate
3.3 V Quad 2-input NAND gate
N-channel TrenchMOS logic level FET, SOT404 (D2PAK), Tape reel SMD
N-channel TrenchMOS standard level FET, SOT404 (D2PAK), Tape reel SMD
Dual rugged ultrafast rectifier diode, 20 A, 200 V, SOT404 (D2PAK), Tape reel SMD
ARM9 microcontroller with CAN and LIN, SOT486-1 (LQFP144), Tray Dry Pack, Bakeable, Single
Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller, SOT570-3 (TFBGA180), Tray Dry Pack, Bakeable, Single
3.3 V Hex inverter
3.3 V Quad 2-input AND gate
Single-chip 16-bit/32-bit microcontrollers; 512 kB flash, with 32 segment x 4 LCD driver, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single
Power LDMOS transistor, SOT502A (LDMOST), Blister pack
Dual 5-input NOR gate
Dual rugged ultrafast rectifier diode, 20 A, 200 V, SOT78 (TO-220AB), Tube pack
Trenchmos (tm) standard level FET, SOT226 (I2PAK), Horizontal, Rail Pack
Dual rugged ultrafast rectifier diode, 20 A, 150 V, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 5mA, 500 V, SOT78, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 15mA, 500 V, SOT78, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 15mA, 800 V, SOT78, SOT78 (TO-220AB), Tube pack
N-channel silicon field-effect transistors
SCR, 12 A, 5 mA, 650 V, SOT78, SOT78 (TO-220AB), Tube pack
Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single
16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface, SOT1048-1 (TFBGA296), Tray Dry Pack, Bakeable, Single
Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single
TrenchMOS (tm) standard level FET, week 1, 2005, 0
WiMAX power LDMOS transistor, SOT502B (LDMOST), Blister pack
UHF power LDMOS transistor, SOT467C (LDMOST), Blister pack
WiMAX power LDMOS transistor, SOT975C (CDFM2), Reel Pack, SMD, 13"
Trenchmos (tm) standard level FET, SOT78 (TO-220AB), Tube pack
Quad transceiver, inverting (3-State); Quad transceiver (3-State) 规格液晶模块
50 V, 100 mA NPN general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
SPECIFICATIONS FOR LCD MODULE 规格液晶模块
Quad 2-input NAND gate 输入与非
50 V, 500 mA NPN general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
Trenchmos (tm) standard level FET, SOT404 (D2PAK), Tape reel SMD 规格液晶模块
N-channel TrenchMOS standard level FET, SOT428 (DPAK), Tape reel SMD 规格液晶模块
50 V, 500 mA PNP general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
Integrated high-performance ESD-protection diodes to IEC61000-4-2, level 4, NAX000, Reel Pack, SMD, Large 规格液晶模块
ESD-Protection for High-Speed Interfaces, SOT1059-1 (XSON10U), Reel Pack, SMD 规格液晶模块
Dual 2-input OR gate, SOT996-2 (XSON8U), Reel Pack, Reverse 规格液晶模块
Dual 4-input NAND gate 规格液晶模块
WiMAX power LDMOS transistor, SOT975B (CDFM2), Bulk Pack 规格液晶模块
Dual 2-input OR gate, SOT505-2 (TSSOP8), Reel Pack, Reverse 规格液晶模块
45 V, 100 mA PNP general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
Quad 2-input OR gate 输入或门
|
Electronic Theatre Controls, Inc.
|
| AM27C1024-120 AM27C1024-150 AM27C1024-200 AM27C102 |
N-channel TrenchMOS logic level FET, SOT669 (LFPAK), Tape reel SMD
|
Advanced Micro Devices, Inc.
|
|
