| PART |
Description |
Maker |
| ML925C45F ML920J45S ML920K45S ML920Y45S ML925B45F |
Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats), SOT612, Reel Dry Pack, SMD, 13"
Triple input HDMI 1.3a compliant receiver interface with equalizer (up to 1080p for HDTV, and UXGA for PC formats), SOT612, Reel Dry Pack, SMD, 13"
Ultra low power multiband silicon tuner, SOT617-1 (HVQFN32), Tray Pack, Bakeable, Multiple
Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats), SOT612, Reel Dry Pack, SMD, 13"
1550,1520nm InGaAsP FP LASER DIODES
|
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| SOT163-1-118 |
SO20 Reel pack; SMD, 13 Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code (12NC) ending 118
|
NXP Semiconductors
|
| AG-16080AFT AG-16080AGA AG-16080AGI AG-16080AGU AG |
3.3 V Triple 3-input NAND gate
Power LDMOS transistor, SOT502B (LDMOST), Reel Pack, SMD, 13"
Quad 2-input NOR gate
3.3 V Quad 2-input NAND gate
N-channel TrenchMOS logic level FET, SOT404 (D2PAK), Tape reel SMD
N-channel TrenchMOS standard level FET, SOT404 (D2PAK), Tape reel SMD
Dual rugged ultrafast rectifier diode, 20 A, 200 V, SOT404 (D2PAK), Tape reel SMD
ARM9 microcontroller with CAN and LIN, SOT486-1 (LQFP144), Tray Dry Pack, Bakeable, Single
Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller, SOT570-3 (TFBGA180), Tray Dry Pack, Bakeable, Single
3.3 V Hex inverter
3.3 V Quad 2-input AND gate
Single-chip 16-bit/32-bit microcontrollers; 512 kB flash, with 32 segment x 4 LCD driver, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single
Power LDMOS transistor, SOT502A (LDMOST), Blister pack
Dual 5-input NOR gate
Dual rugged ultrafast rectifier diode, 20 A, 200 V, SOT78 (TO-220AB), Tube pack
Trenchmos (tm) standard level FET, SOT226 (I2PAK), Horizontal, Rail Pack
Dual rugged ultrafast rectifier diode, 20 A, 150 V, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 5mA, 500 V, SOT78, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 15mA, 500 V, SOT78, SOT78 (TO-220AB), Tube pack
SCR, 12 A, 15mA, 800 V, SOT78, SOT78 (TO-220AB), Tube pack
N-channel silicon field-effect transistors
SCR, 12 A, 5 mA, 650 V, SOT78, SOT78 (TO-220AB), Tube pack
Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single
16/32-bit ARM microcontrollers; hardware floating-point coprocessor, USB On-The-Go, and EMC memory interface, SOT1048-1 (TFBGA296), Tray Dry Pack, Bakeable, Single
Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single
TrenchMOS (tm) standard level FET, week 1, 2005, 0
WiMAX power LDMOS transistor, SOT502B (LDMOST), Blister pack
UHF power LDMOS transistor, SOT467C (LDMOST), Blister pack
WiMAX power LDMOS transistor, SOT975C (CDFM2), Reel Pack, SMD, 13"
Trenchmos (tm) standard level FET, SOT78 (TO-220AB), Tube pack
Quad transceiver, inverting (3-State); Quad transceiver (3-State) 规格液晶模块
50 V, 100 mA NPN general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
SPECIFICATIONS FOR LCD MODULE 规格液晶模块
Quad 2-input NAND gate 输入与非
50 V, 500 mA NPN general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
Trenchmos (tm) standard level FET, SOT404 (D2PAK), Tape reel SMD 规格液晶模块
N-channel TrenchMOS standard level FET, SOT428 (DPAK), Tape reel SMD 规格液晶模块
50 V, 500 mA PNP general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
Integrated high-performance ESD-protection diodes to IEC61000-4-2, level 4, NAX000, Reel Pack, SMD, Large 规格液晶模块
ESD-Protection for High-Speed Interfaces, SOT1059-1 (XSON10U), Reel Pack, SMD 规格液晶模块
Dual 2-input OR gate, SOT996-2 (XSON8U), Reel Pack, Reverse 规格液晶模块
Dual 4-input NAND gate 规格液晶模块
WiMAX power LDMOS transistor, SOT975B (CDFM2), Bulk Pack 规格液晶模块
Dual 2-input OR gate, SOT505-2 (TSSOP8), Reel Pack, Reverse 规格液晶模块
45 V, 100 mA PNP general-purpose transistors, SOT23 (TO-236AB), Tape reel SMD 规格液晶模块
Quad 2-input OR gate 输入或门
|
Electronic Theatre Controls, Inc.
|
| SA5234D/01518 |
Matched quad high-performance low-voltage operational amplifier; Package: SOT108-1 (SO14); Container: Reel Dry Pack, SMD, 13" QUAD OP-AMP, 5000 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO14
|
NXP Semiconductors N.V.
|
| CR05AS-8-ET24 CR05AS-8 CR05AS-8-ET14 |
8-bit microcontroller with accelerated two-clock 80C51 core, 4 kB/8 kB/16 kB 3 V byte-erasable flash with 8-bit ADCs, SOT361-1 (TSSOP28), Reel Dry Pack, SMD, 13"
Thyristor Low Power Use
8-bit microcontroller with accelerated two-clock 80C51 core 8 kB 3 V byte-erasable flash with 512-byte data EEPROM, SOT117-1 (DIP28), Tube
8-bit microcontroller with accelerated two-clock 80C51 core, 4 kB/8 kB/16 kB 3 V byte-erasable flash with 8-bit ADCs, SOT361-1 (TSSOP28), Reel Dry Pack, SMD, 13"
Smartcard RTC; ultra low power oscillator with integrated counter for initiating one time password generation, Uncased die, Circuit Element Packed On Reel 7"
Smartcard RTC; ultra low power oscillator with integrated counter for initiating one time password generation, Uncased die, Circuit Element Packed On Reel 7"
|
RENESAS[Renesas Electronics Corporation]
Renesas Electronics Corporation.
|
| C1206C2745RAC C1206C6845RAC C1206C68415RAC C1206C3 |
Triple buffer with open-drain outputs, SOT505-2 (TSSOP8), Reel Pack, Reverse
3.3 V 16-bit buffer/driver; 3-state, SOT362-1 (TSSOP48), Tube
3.3 V 16-bit buffer/driver; 3-state, SOT1025-1 (HUQFN60U), Reel Dry Pack, 7" 表面贴装陶瓷电容扩展206，X7R介质500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质5500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质255000200伏特
|
KEMET Corporation
|
| PCA9671PW118 PCA9671BS118 PCA9671PW PCA9671BQ PCA9 |
Remote 16-bit I/O expander for Fm I2C-bus with reset; Package: SOT616-1 (HVQFN24); Container: Reel Pack, SMD, 13" 16 I/O, PIA-GENERAL PURPOSE, PQCC24
Remote 16-bit I/O expander for Fm I2C-bus with reset; Package: SOT355-1 (TSSOP24); Container: Reel Pack, SMD, 13" 16 I/O, PIA-GENERAL PURPOSE, PDSO24
|
NXP Semiconductors N.V.
|
| PCA8565 PCA8565BS PCA8565TS PCA8565BS/1118 PCA8565 |
Real time clock/calendar; Package: SOT650-1 (HVSON10); Container: Reel Pack, SMD, 13" 1 TIMER(S), REAL TIME CLOCK, PDSO10
Real time clock/calendar; Package: SOT505-1 (TSSOP8); Container: Reel Pack, SMD, 13" 1 TIMER(S), REAL TIME CLOCK, PDSO8
|
NXP Semiconductors N.V.
|
| SC68C752BIB48 SC68C752BIBS SC68C752BIB48128 SC68C7 |
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs and Motorola uP interface; Package: SOT617-1 (HVQFN32); Container: Reel Pack, SMD, 13", Turned 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC32
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs and Motorola uP interface; Package: SOT313-2 (LQFP48); Container: Reel Pack, SMD, 13", Turned 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQFP48
|
NXP Semiconductors N.V.
|
| T8208-BAL-DT |
CelXpres ATM interconnect. Dry-bagged, tape & reel.
|
Agere Systems
|
| SAF7129AH SAF7129AH/V1557 |
Digital video encoder; Package: SOT803-1 (QFP44); Container: Tray Dry Pack, Bakeable, Multiple
|
NXP Semiconductors N.V.
|
| PX1011B-EL1/N551 PX1011B-EL1/N557 PX1011BI-EL1/G51 |
PCI Express stand-alone X1 PHY; Package: SOT643-1 (LFBGA81); Container: Tray Dry Pack, Bakeable, Single
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NXP Semiconductors N.V.
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