| PART |
Description |
Maker |
| PXA270 NHPXA270 NHPXA270CXXX |
Electrical, Mechanical, and Thermal Specification
|
INTEL[Intel Corporation]
|
| BGA318 |
Silicon Bipolar MMIC-Amplifier (Cascadable 50 W-gain block 16 dB typical gain at 1.0 GHz 12 dBm typical P-1dB at 1.0 GHz)
|
Siemens Semiconductor Group
|
| ACC701-000 |
10/100Mb/s Electrical-to-Electrical Ethernet Demarcation Device.
|
JDS Uniphase Corporation
|
| VTD175 VTD170XS VTD170 VTD175L VTD175S VTD175XL VT |
85 ∑C to -40 ∑C 10 times % typical resistance change
85 ∑C to -40 ∑C 10 times 【5 % typical resistance change
POLYFUSE RESETTABLE FUSES
85 °C to -40 °C 10 times ±5 % typical resistance change
|
Littelfuse, Inc.
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| EMC1428-1-AP EMC1428-6-AP |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| KD2004-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD3002-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD2004-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KF2003-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
