| PART |
Description |
Maker |
| 1648205-1 |
CONNECTOR, PIN SIZE 16, 20, 12 CONFIG LOWER DRAWER
|
Tyco Electronics
|
| RBV1000 RBV1001 RBV1002 RBV1004 RBV1006 RBV1008 RB |
SILICON BRIDGE RECTIFIERS
INDUCTOR/XFRMR 160UH 6 CONFIG
|
Electronics Industry Public Company Limited
|
| MC68HC11KA0 |
CONFIG Register Programming for EEPROM-based M68HC11 Microcontrollers 配置寄存器编程的基于EEPROM M68HC11微控制器
|
Motorola Mobility Holdings, Inc.
|
| 6-104349-0 6-104349-1 6-104349-6 6-104349-3 6-1043 |
HEADER ASSY, MOD II, BREAKAWAY, RIGHT ANGLE, SINGLE ROW, .100 C/L, .025 SQ. POSTS, W/HOLD-DOWN CONFIG
|
Tyco Electronics
|
| XFPMC-105KPAR |
Pre-amplified/5V Excitation/Absolute Pre-amplified/5V励磁/绝对
|
Fujikura, Ltd.
|
| XFGN-6050KPGSR XFGN-6100KPGVSR XFPN-025KPGR XFPN-1 |
Pre-amplified/5V Excitation/Gauge Pre-amplified/5V励磁/
|
Fujikura, Ltd.
|
| SPS-445-3-E SPS-445-2-E SPS-445-1-E |
Receiver Pre-amp Module for Infrared Remote Control(用于红外远程控制的载波频3.3 kHz的接收前置放大器模块)
Receiver Pre-amp Module for Infrared Remote Control(用于红外远程控制的载波频33.3 kHz的接收前置放大器模块) 接收机前置放大器的红外遥控器（用于红外远程控制的载波频率33.3千赫模块的接收前置放大器模块
Receiver Pre-amp Module for Infrared Remote Control(用于红外远程控制的载波频6.7 kHz的接收前置放大器模块) 接收机前置放大器的红外遥控器（用于红外远程控制的载波频率6.7千赫模块的接收前置放大器模块
LOGIC OUTPUT PHOTO DETECTOR
|
Sanyo Electric Co.,Ltd.
Sanyo Electric Co., Ltd.
MEAN WELL Enterprises Co., Ltd.
Astrodyne, Inc.
|
| CXA1634P/M |
0.03 W, 2 CHANNEL, AUDIO AMPLIFIER, PDIP16
Pre-Power Amplifier for Pocketable Stereo CassettePlayer
Pre-Power Amplifier for Pocketable Stereo Cassette
|
SONY
|
| KA22291 |
PLAYBACK/RECORD PRE AMPLIFIER FOR DOUBLE DECK
PLAYBACK/RECORD PRE AMPLIFIER FOR DOULE DECK
|
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| 2SC9014 |
PRE-AMPLIFIER, LOW LEVEL & LOW NOISE
PRE-AMPLIFIER/ LOW LEVEL & LOW NOISE
Transistors
PRE-AMPLIFIER, LOW LEVEL & LOW NOISE
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
USHA India LTD
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
|
