| LD08PC753KAB3A LD08PC753KAB1A LD05-20 LD20 LD13 LD |
CAPACITOR, CERAMIC, MULTILAYER, 250 V, X7R, 0.075 uF, SURFACE MOUNT, 1808 CHIP Tip & Ring Tin/Lead Termination “B Multilayer Ceramic Chip Capacitors Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
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AVX, Corp. AVX Corporation
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| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
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AVX, Corp.
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