| PART |
Description |
Maker |
| 43045-0202 43045-0200 43045-0201 430450200 43045-0 |
MICRO-FIT (3.0) DUAL ROW RIGHT ANGLE THRU HOLE HEADER ASSY
|
Molex Electronics Ltd.
|
| 171825-2 171825-4 171825-5 171825-6 171825-9 17182 |
POST HEADER ASSY (VERTICAL) AMP EI SERIES CONNECTOR
|
Tyco Electronics
|
| 5103308-3 5103308-6 5103308-2 5103308-1 5103308-7 |
HEADER ASSY, VERTICAL, LOW PROFILE, AMP-LATCH
|
Tyco Electronics
|
| 85013-3081 0850133081 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 85013-3122 0850133122 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 96 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 15-80-0123 0015800123 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0063 0015800063 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0015800685 70567-0168 A-70567-0168 15-80-0685 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0103 0015800103 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0283 0015800283 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
