| PART |
Description |
Maker |
| LHA01APTAI001 |
LED Heat Dissipation Substrate
|
List of Unclassifed Manufacturers
|
| SP-QR-C-1841A |
Heat Dissipation from NC4U13xx depending on Tj
|
NICHIA CORPORATION
|
| KSMT451N |
Excellent package for good heat dissipation.
|
Kersemi Electronic Co.,...
|
| KSMB3710 |
Excellent package for good heat dissipation.
|
Kersemi Electronic Co.,...
|
| L218-3580048C00000 |
Linear LED module on an ultra-slim and rigid substrate enabling high efficacy designs
|
Lumileds Lighting Compa...
|
| 190150 |
GaAlAs / GaAlAs LED Chips (substrate removed)
|
OSA Opto Light GmbH
List of Unclassifed Manufacturers
|
| 115180 |
GaAlAs / GaAlAs LED Chips (substrate removed)
|
OSA Opto Light GmbH
|
| ATS037037025-PF-12X |
37.00 x 37.00 x 25.00 mm BGA Heat Sink (Heat Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| TA307 TA207 TA810 TA310 TA100 TA805 TA305 TA203 TA |
TA Series / Power Chip Resisters / Thick Film on Alumina Substrate
Power Chip Resistors Thick Film on Alumina Substrate
|
Ohmite
List of Unclassifed Manufacturers
ETC[ETC]
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
