| PART |
Description |
Maker |
| LPD19-6B LPD19-4B LPD19-5B LPD19-3B LPD19-7B LPD19 |
Low Pressure Drop Heat Sink
|
ALPHA
|
| ATS037037025-PF-12X |
37.00 x 37.00 x 25.00 mm BGA Heat Sink (Heat Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ATS-19G-117-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-121-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-03-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-312-EXL-R0 |
HEAT SINK THERMAL RESISTANCE
|
Advanced Thermal Solutions, Inc.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| CP308 CP3010 CP300 CP306 CP304 CP302 CP301 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A 单相硅桥式PC的MTG的甲，热沉MTG3A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A
|
Transys Electronics, Ltd.
TRSYS
|
| MG1037-16 MG1017-16 MG1036-16 MG1010-11 MG1040-16 |
GUNN Diodes Cathode Heat Sink
|
Microsemi Corporation
|
| ATS-1104-C1-R0 |
Heat Sink for Half Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
| ATS-53250R-C1-R0 |
BGA Heat Sink - High Performance
|
Advanced Thermal Soluti...
|
