| PART |
Description |
Maker |
| PC825 PC845 PC815 PC835 |
(PC815 - PC845) High Sensitivity / High Density Mounting Type Photocoupler
High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| PC816-SERIES |
High Collector-emitter Voltage, High Density Mounting Type Photocoupler
|
SHARP
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
