| PART |
Description |
Maker |
| 80C51FA TP80C51FA LN83C51FA TN83C51FA LN80C51FA AN |
(193.00 k) 93.00十一
DIP Switch; No. of Switch Positions:3; Circuitry:SPST; Contact Current Max:100mA; Switch Terminals:Through Hole; Pitch Spacing:2.54mm; Row Spacing:8mm; Series:SD; Actuator Style:Flush Slide RoHS Compliant: Yes 93.00十一
Event-Control CHMOS Single Chip 8-Bit Microcontroller(控制事件CHMOS 单片8位微控制
EVENT-CONTROL CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER
|
XP Power, Ltd.
Intel Corp.
INTEL[Intel Corporation]
Panasonic Semiconductor
|
| C4AQUBW5270A3NJ |
C4AQ, Film, Metallized Polypropylene, Automotive DC Link, 27 uF, 5%, 1,300 V, 70C, Lead Spacing = 52.5mm
|
Kemet Corporation
|
| C4AQUBU4500A12J |
C4AQ, Film, Metallized Polypropylene, Automotive DC Link, 5 uF, 5%, 1,300 V, 70C, Lead Spacing = 27.5mm
|
Kemet Corporation
|
| C4AQUBW5250A3NJ |
C4AQ, Film, Metallized Polypropylene, Automotive DC Link, 25 uF, 5%, 1,300 V, 70C, Lead Spacing = 52.5mm
|
Kemet Corporation
|
| C4AQUBW5100A3JJ |
C4AQ, Film, Metallized Polypropylene, Automotive DC Link, 10 uF, 5%, 1,300 V, 70C, Lead Spacing = 37.5mm
|
Kemet Corporation
|
| 39-30-1039 39301039 39-30-5038 39-30-5037 39-30-60 |
MINI-FIT JR. VERT. HDR. ASSY. W/PEGS, WITH & W/O DRAIN HOLES (SINGLE ROW)
Header; No. of Contacts:3; Pitch Spacing:0.165"; No. of Rows:1; Series:Mini-Fit Jr.; Body Material:Nylon 6/6 RoHS Compliant: Yes 3 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
|
Molex Electronics Ltd.
Molex, Inc.
|
| ICS-3XX-SMB-T |
IC SOCKET ROW SPACING TIN PLATED
|
Adam Technologies, Inc.
|
| ICS-3XX-T |
IC SOCKET ROW SPACING TIN PLATED
|
Adam Technologies, Inc.
|
| C4ASPBU3470A3GJ |
Film, Metallized Polypropylene, Power, C4AS, 0.47 uF, 5%, 1,200 V, 70C, Lead Spacing = 27.5mm
|
Kemet Corporation
|
| 1ZC24 1ZC43 1ZC91 1ZC100 1ZC110 1ZC12 1ZC120 1ZC13 |
ZENER DIODE 1W CONSTANT VOLTAGE REGULATION TELEPHONE, PRINTER USES
TOSHIBA ZENER DIODE SILICON DIFFUSED TYPE
240 VAC 3-PH OVER/UNDER VOLT. RLY
Card Edge Connector; Number of Contacts:64; Pitch Spacing:1mm; Tail Length:2.30mm; Contact Termination:Solder; Connector Mounting:PC Board; Contact Material:Phosphor Bronze; Contact Plating:Tin; Leaded Process Compatible:Yes
surface mount silicon Zener diodes
Card Edge Connector; Number of Contacts:36; Pitch Spacing:1mm; Tail Length:2.30mm; Contact Termination:Solder; Connector Mounting:PC Board; Contact Material:Phosphor Bronze; Contact Plating:Tin; Leaded Process Compatible:Yes 东芝稳压二极管硅扩散
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
Toshiba, Corp.
|
| 50011-8000 50011-8100 |
Crimp Socket Contact; Wire Size (AWG):30-24; Contact Current:2A; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Reel Quantity:10000; Voltage Rating:125V RoHS Compliant: Yes
Crimp Socket Contact; Wire Size (AWG):30-24; Contact Plating:Tin; Series:50011; Strip Length:2.1mm; Operating Temp. Min:-20 C; Pitch Spacing:2mm; Voltage Rating:125V RoHS Compliant: Yes
|
MOLEX INC
|
|
