| PART |
Description |
Maker |
| 0900590017 90059-0017 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, White Housing
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, White Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590020 90059-0020 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, Black Housing
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, Black Housing
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0900590013 90059-0013 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 35mm Pretinned Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 35mm Pretinned Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| HLMP-1550 HLMP-1550-1.00000 HLMP-1550-1.00001 HLMP |
Half pitch interface connectors (HRS unique); HRS No: 230-1022-7 50; Connector Type: Cable; Contact Mating Area Plating: Gold
Low Profile T-1 (3 mm) LED Lamps
HLMP-1350-C0001 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1350-C0002 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1550-BC000 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1450 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1450-B0000 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1450-B0001 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1450-B0002 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1550-A0001 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1550-A0002 · Low Profile T-1 (3 mm) LED Lamp
HLMP-1350 · Low Profile T-1 (3 mm) LED Lamp
|
发光二极
Agilent(Hewlett-Packard)
Agilent (Hewlett-Packard)
|
| 830-1A-1201-EXX 830-1A-1200-EXX 830-1A-1210-EXX 83 |
AUTOMOTIVE LOW PROFILE MICRO RELAY
|
OEN India Limited
|
| 0900590009 90059-0009 |
2.54mm (.100) Pitch C-Grid? Micro Shunt, Low Profile, 15mm Select Gold (Au) with Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Micro Shunt, Low Profile, 15mm" Select Gold (Au) with Gold (Au) Flash Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| MLDM1L-37S-6C4-.250B MLDM1L-15P-4K5-18F MLDM1L-15P |
MLDM Low Profile Metal Shell Micro-D Insulated Wire Termination
|
Glenair, Inc.
|
| 447AS327XM08 447FS327XM08 447LS327XM08 447SS327XM0 |
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty垄莽 Strain Relief
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty? Strain Relief
|
Glenair, Inc.
|
| 0900590013-17 |
2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.889μm Pre-tinned Plating
|
Molex Electronics Ltd.
|
| MAX3370EXKT |
1µA, 2Mbps, Low-Voltage Level Translators in SC70 and µDFN
|
MAXIM - Dallas Semiconductor
|
| IHLP4040DZER2R0M11 IHLP-4040DZ-11 |
Low Profile, High Current IHLP? Inductor
Low Profile, High Current IHLP庐 Inductor
Low Profile, High Current IHLP垄莽 Inductor
Low Profile, High Current IHLP㈢ Inductor
|
Vishay Siliconix
|
