| PART |
Description |
Maker |
| CYM1831V33PZ-12C CYM1831V33PZ-25C |
256K X 8 MULTI DEVICE SRAM MODULE, 12 ns, PZMA64
256K X 8 MULTI DEVICE SRAM MODULE, 25 ns, PZMA64
|
Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
|
| CYM1841LPN-55C CYM1841LPN-35C CYM1841LPN-45C |
256K X 32 MULTI DEVICE SRAM MODULE, 55 ns, SMA64
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64
|
Cypress Semiconductor, Corp.
|
| WPS256K32-17PJC |
256K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PQMA68
|
WHITE ELECTRONIC DESIGNS CORP
|
| CYM1841CP7-20C |
256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, SMA72
|
Cypress Semiconductor, Corp.
|
| SYS32256ZK-12 SYS32256ZK-15 SYS32256ZK-17 SYS32256 |
256K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PZMA64 PLASTIC, ZIP-64
256K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PZMA64 PLASTIC, ZIP-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
256K x 32 SRAM MODULE
|
MOSAIC
|
| CYM26KAH24AV33-10BGC CYM26KAH24AV33-12BGC CYM26KAH |
256K X 24 MULTI DEVICE SRAM MODULE, 10 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
256K X 24 MULTI DEVICE SRAM MODULE, 12 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Memory 内存
|
Cypress Semiconductor, Corp.
Electronic Theatre Controls, Inc.
|
| MF38M1-LCDAGBM MF38M1-L6DAGAM MF38M1-LSDAGAM MF88M |
8M X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
8M X 8 FLASH 5V PROM CARD, 25 ns, XMA68
8M X 8 FLASH 5V PROM CARD, 70 ns, XMA68
20M X 8 FLASH 5V PROM CARD, 150 ns, XMA68
512K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
256K X 8 MULTI DEVICE SRAM CARD, 200 ns, XMA
|
Ironwood Electronics
Numonyx Asia Pacific Pte, Ltd.
|
| CYM1821PZ-12C CYM1821PM-12C |
16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, ZMA64
16K X 32 MULTI DEVICE SRAM MODULE, 12 ns, SMA64
|
Cypress Semiconductor, Corp.
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| GS72108TP-8I GS72108J-10 GS72108J-10I GS72108J-12 |
256K X 8 STANDARD SRAM, 12 ns, PDSO44
256K X 8 STANDARD SRAM, 10 ns, PDSO44
TV 4C 4#12 SKT RECP 256K × 8Mb异步SRAM
256K x 8 2Mb Asynchronous SRAM 256K × 82Mb异步SRAM
TV 15C 14#20 1#16 SKT RECP 256K × 8Mb异步SRAM
256K X 8 STANDARD SRAM, 10 ns, PDSO36 0.400 INCH, SOJ-36
TV 5C 5#16 PIN RECP 256K × 8Mb异步SRAM
256K X 8 STANDARD SRAM, 8 ns, PDSO36 0.400 INCH, SOJ-36
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; No. of Contacts:37; Connector Shell Size:15; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 256K × 8Mb异步SRAM
|
ETC
GSI Technology, Inc.
Electronic Theatre Controls, Inc.
GSI[GSI Technology]
|
| CYM1836V33P8-35C CYM1836V33P8-45C CYM1836V33PM-30C |
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72
512K X 8 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
|
Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
|
| CY7C1366B-200BGI CY7C1366B-200BGC CY7C1366B-225BGI |
Low Cost, 300 MHz Rail-to-Rail Amplifier (Single); Package: SOT-23; No of Pins: 5; Temperature Range: Industrial 512K X 18 CACHE SRAM, 3.5 ns, PQFP100
CONNECTOR ACCESSORY 512K X 18 CACHE SRAM, 3 ns, PQFP100
9-Mb (256K x 36/512K x 18) Pipelined DCD Sync SRAM 512K X 18 CACHE SRAM, 2.8 ns, PBGA119
9-Mb (256K x 36/512K x 18) Pipelined DCD Sync SRAM 256K X 36 CACHE SRAM, 2.8 ns, PBGA165
9-Mb (256K x 36/512K x 18) Pipelined DCD Sync SRAM 9 - MB的（256 × 36/512K × 18）流水线双氰胺同步静态存储器
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
|
