| PART |
Description |
Maker |
| 71764-0106 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87835-3442 |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating,
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
|
Molex Electronics Ltd.
|
| 71764-0114 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 71764-0104 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 70247-2654 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
|
Molex Electronics Ltd.
|
| 70247-1451 0702471451 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
| 70247-0851 0702470851 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
| 87834-4419 |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator
|
Molex Electronics Ltd.
|
| 71764-0020 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
| 71764-0026 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
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