| PART |
Description |
Maker |
| 1FGS304-551TG MGS272-636TT FBS225-551GG FBS225-551 |
304 POS FR-4 BGA SOCKET BGA304, IC SOCKET
272 POS 1.27MM BGA SOCKET BGA272, IC SOCKET
225 POS FR-4 BGA SOCKET BGA225, IC SOCKET
521 POS FR-4 BGA SOCKET BGA521, IC SOCKET
303 POS FR-4 BGA SOCKET BGA303, IC SOCKET
540 POS FR-4 BGA SOCKET BGA540, IC SOCKET
456 POS FR-4 BGA SOCKET BGA456, IC SOCKET
475 POS FG4 BGA SOCKET BGA475, IC SOCKET
400 POS 1.27MM BGA SOCKET
BGA240, IC SOCKET
BGA400, IC SOCKET
BGA121, IC SOCKET
BGA396, IC SOCKET
BGA256, IC SOCKET
169 POS FR-4 BGA SOCKET
BGA169, IC SOCKET
432 POS FR-4 BGA SOCKET
BGA204, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| IT3D-300S-BGA TR0636E-20027 |
IT3D(M)-300S-BGA (57) BGA Shearing Force TEST REPORT
|
Hirose Electric
|
| CXK77P36E160GB-43BE CXK77P18E160GB-4BE CXK77P18E16 |
1M X 18 STANDARD SRAM, 3.7 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 4.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 3.8 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
1M X 18 STANDARD SRAM, 4.1 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
16Mb LW R-L HSTL High Speed Synchronous SRAMs (512K x 36 or 1M x 18) 16Mb的龙运RL HSTL高速同步静态存储器（为512k × 3600万18
CAP 820PF 50V 20% X7R SMD-0603 TR-7 PLATED-NI/SN
|
http://
Yuasa Battery, Inc.
Integrated Circuit Technology Corp
Microsemi, Corp.
Sony, Corp.
Sony Corporation
|
| IBM25PPC740L-GB300A2R IBM25PPC740L-GB350A2R IBM25P |
32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 350 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 375 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 400 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
|
Electronic Theatre Controls, Inc.
|
| IBM25PPC440GX-3FB533C IBM25PPC440GX-3CB533C IBM25P |
32-BIT, 533 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
32-BIT, 533 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
32-BIT, 667 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
|
Mitsubishi Electric, Corp.
|
| K7P401811M-HC160 K7P403611M-HC200 K7P403611M |
128Kx36 & 256Kx18 Synchronous Pipelined SRAM Data Sheet
128K X 36 STANDARD SRAM, 2.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
|
Samsung Electronic
|
| IBM25PPC740L-GB375A2T IBM25PPC740L-GB375A2R IBM25P |
MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC 微处理器| 32位|的CMOS | BGA封装| 255PIN |陶瓷
|
Glenair, Inc.
Vishay Semiconductors
|
| FW80321M600Q467 FW80321M400Q466 |
600 MHz, RISC PROCESSOR, PBGA544 PLASTIC, BGA-544
400 MHz, RISC PROCESSOR, PBGA544 PLASTIC, BGA-544
|
Intel, Corp.
|
| K7P401823B-HC650 K7P401823B-HC750 K7P403623B |
256K X 18 STANDARD SRAM, 6.5 ns, PBGA119 14 X 22 MM, BGA-119
256K X 18 STANDARD SRAM, 7.5 ns, PBGA119 14 X 22 MM, BGA-119
128Kx36 & 256Kx18 SRAM
|
Samsung semiconductor
|
| IS61NVP51236-250B2I IS61NVP102418-250B2I IS61NVP10 |
512K X 36 ZBT SRAM, 2.6 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
1M X 18 ZBT SRAM, 2.6 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
1M X 18 ZBT SRAM, 3.1 ns, PBGA119 14 X 22 MM, 1 MM PITCH, PLASTIC, BGA-119
|
Integrated Silicon Solution, Inc.
|
| W9864G2DB-7 |
BGA SDRAM
|
Winbond Electronics
|
|
