| PART |
Description |
Maker |
| CG0603MLD-12E CG0402MLD-12G |
Chip Guard? MLD Series Varistor ESD Clamp Protectors
Chip Guard㈢ MLD Series Varistor ESD Clamp Protectors
|
BOURNS[Bourns Electronic Solutions]
|
| FC0603E50R0BST1 FC0603E5100FGWS FC0603E50R0BTBTS F |
THIN FILM,0603,25PPM,50,.1%,TR,HAZMAT - Tape and Reel
THIN FILM,0603,125MW,510,1%,25PPM - Waffle Pack
FC High Frequency (up to 20 GHz) Resistor, Thin Film Surface Mount Chip
RES THNFLM 0603 33.2 OHM 1% 1/8W 100PPM MLD SMD - Tape and Reel
THIN FILM 0402 332 0.1% 25PPM - Tape and Reel
RES THNFLM 0603 17.8 OHM 1% 1/8W 100PPM MLD SMD - Tape and Reel
THIN FILM,0402,100,.1%,25PPM - Bulk
THIN FILM,0402,122,0.1%,25PPM - Tape and Reel
RES THNFLM 0603 53.6 OHM 0.1% 1/8W 25PPM MLD SMD - Tape and Reel
THIN FILM,HF,0603,25PPM,50 OHM,,.5%,WAFFLE,HAZMAT - Waffle Pack
RES THNFLM 0402 100 OHM 0.1% 1/20W 25PPM MLD SMD - Waffle Pack
|
Vishay Dale
|
| VRS550-PAC25 VRS560-PAC25 VRS550-PLI25 VRS560-PLI2 |
VRS550 - 8kB Flash, 256B RAM, 25MHz, 8-Bit MCU VRS560 - 16kB Flash, 256B RAM, 25MHz, 8-Bit MCU VRS550 - 8KB闪存56B的RAM5MHz的，8位微控制器VRS560 - 16kB的闪存，256B的RAM5MHz的，8位微控制
VRS550 - 8kB Flash, 256B RAM, 25MHz, 8-Bit MCU VRS560 - 16kB Flash, 256B RAM, 25MHz, 8-Bit MCU
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| 554434-1 |
2.16 [.085] IDC Connectors; EMI RCPT ASSY,24 POSN,SHLD ( AMP )
|
Tyco Electronics
|
| S307 S30760 R30760 R30720 R30740 S30720 S30740 |
Inductor; Inductor Type:Standard; Inductance:100nH; Inductance Tolerance: 5 %; Current Rating:300mA; Series:LG HK; Package/Case:0603; Core Material
Silicon Power Rectifier
|
MICROSEMI[Microsemi Corporation]
|
| GTL-2691 |
24 Gigabit Ethernet ports with 4 shared SFP slots and 2 10G slots Multicast routing IGMP V1/V2/V3, MLD
|
Level One
|
| GSW-4876 |
48 Gigabit Ethernet ports and 2 Gigabit SFP slots MLD, Telnet, SNMP V1, V2c & V3, RMON, Web Browser, and TFTP Management
|
Level One
|
| ISC1210SY820K ISC1210EB1R5K ISC1210EB101J ISC1210B |
General Fixed Inductor, IND,POWDERED IRON,82UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, 1 ELEMENT, 1.5 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1210, HALOGEN FREE AND ROHS COMPLIANT
General Fixed Inductor, IND,POWDERED IRON,100UH,5% TOL,5% -TOL,1210 CASE
ISC-1210 Wirewound, Surface Mount, Molded, Shielded Inductors
General Fixed Inductor, IND,POWDERED IRON,10UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, 1 ELEMENT, 22 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, ROHS COMPLIANT
General Fixed Inductor, IND,POWDERED IRON,3.3UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, IND,POWDERED IRON,15UH,10% TOL,10% -TOL,1210 CASE
General Fixed Inductor, IND,POWDERED IRON,15UH,5% TOL,5% -TOL,1210 CASE
|
Vishay Dale
|
| PUMA2F16006M-90 PUMA2F16006-90 PUMA2F16006M-120E P |
32-Tap, Volatile DPP with I2C/DEC, Up/Down Interface, TSSOP
BGA, ROHS-A, IND TEMP, T&R(ARM)
BGA,GREEN,IND TEMP,T&R(ARM)
x32 Flash EEPROM Module X32号，闪存EEPROM模块
EEPROM EEPROM
|
Infineon Technologies AG
Amphenol Tuchel
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
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