| PART |
Description |
Maker |
| CL31A226MQCLNNC |
Multi Layer Ceramic Capacitor
|
Samsung
|
| CL21A106KPFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
| CL10A105KO8NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL10A106KP8NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL21B473KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| DA01 |
CERAMIC MULTI-LAYER AXIAL
|
Dubilier
|
| MCH032A1R5CK MCH038FN103ZK MCH03 MCH032A010CK MCH0 |
Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
| MCH318FN106JK MCH318FN106ZP MCH31 MCH312FN106JK MC |
Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
| FK28X7R2A152K FK26X7R1E335K FK26X7R1C685K FK26X7R1 |
Capacitor with Multi-layer Lead
Capacitor with Multi-layer Lead
|
TDK Electronics
|
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
|
