| PART |
Description |
Maker |
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528304422 52830-4422 |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528304432 52830-4432 |
Modular Jack, Right Angle, 4/4, 0.76μm (30μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.76楼矛m (30楼矛") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528306642 52830-6642 |
Modular Jack, Right Angle, 6/6 Circuits, 1.3渭m (50渭 ") Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 6/6 Circuits, 1.3μm (50μ ) Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143203 87914-3203 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
|
Molex Electronics Ltd.
|
| 0877580816 87758-0816 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87957-1004 0879571004 |
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 4 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0674921121 67492-1121 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 3.55mm (.140"), 0.76渭m (30渭") Gold (Au) Plating, Tray Packaging, 22 Circuits, L
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height 3.55mm (.140), 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, 22 Circuits, LeadFree
|
Molex Electronics Ltd.
|
| BWR-12/125-D12 BWR-12/125-D48 BWR-5/250-D48 BWR-15 |
Rad-hard hex buffer/converter
Rad-hard triple 3-input NOR gate
Rad-hard quad D-type flip flop with clear
Rad-hard 4 bit synchronous up/down counters 型DC - DC电压转换
|
Ohmite Mfg. Co.
|
| 87914-0807 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging
|
Molex Electronics Ltd.
|
| 0528306242 52830-6242 |
Modular Jack, Right Angle, 6/2 Circuits, 1.3μm (50μ ) Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
