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MT29C4G48MAZAPAKD-5IT - NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family

MT29C4G48MAZAPAKD-5IT_6500733.PDF Datasheet


 Full text search : NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family
 Product Description search : NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family


 Related Part Number
PART Description Maker
MT29C4G48MAZAPAKD-5IT NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP? MT29C Family
Micron Technology
K522H1HACF-B050 2Gb (128M x16) NAND Flash 1Gb (64M x16 ) Mobile DDR SDRAM
Samsung semiconductor
K9F1G08Q0M-PCB0 K9F1G08Q0M-PIB0 K9F1G08Q0M-YCB0 K9 128M x 8 Bit / 64M x 16 Bit NAND Flash Memory
1Gb Gb 1.8V NAND Flash Errata
Samsung Electronic
SAMSUNG[Samsung semiconductor]
H27U518S2CTR-BC H27U518S2C 512 Mbit (64 M x 8 bit) NAND Flash
512 Mb NAND Flash
Hynix Semiconductor
MB84VD23581FJ-70PBS 64 M ( x 16) FLASH MEMORY & 64 M ( x 16) Mobile FCRAM
64 M ( x 16) FLASH MEMORY & 64 M ( x 16) Mobile FCRAM 64米(× 16)闪
Spansion Inc.
Spansion, Inc.
HY27UA081G1M HY27SA1G1M HY27SA161G1M-TPCB (HY27SAxxx) 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
64M X 16 FLASH 1.8V PROM, 12000 ns, PDSO48
Hynix Semiconductor Inc.
HY27LF081G2M-TCP HY27LF081G2M-TCS HY27LF161G2M-TCB Inductor; Inductor Type:Power; Inductance:2uH; Inductance Tolerance: 25 %; Series:CTX; Package/Case:PCB Surface Mount; Core Material:Amorphous Metal; Current, lt rms Parallel:7.26A; Current, lt rms Series:3.63A RoHS Compliant: Yes
3.3V Differential Transceiver 8-PDIP -40 to 85
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 128M X 8 FLASH 1.8V PROM, 30 ns, PDSO48
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 64M X 16 FLASH 1.8V PROM, 30 ns, PDSO48
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory 64M X 16 FLASH 3.3V PROM, 30 ns, PDSO48
CONNECTOR ACCESSORY 128M X 8 FLASH 3.3V PROM, 30 ns, PDSO48
CONNECTOR ACCESSORY 64M X 16 FLASH 1.8V PROM, 30 ns, PDSO48
Power Heater Soldering Tip; Tip/Nozzle Style:Chisel; Tip/Nozzle Thickness:0.2"; Tip/Nozzle Size:0.40 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
COILTRONICS RoHS Compliant: Yes 1Gbit的(128Mx8bit / 64Mx16bit)NAND闪存
Power Heater Soldering Tip; Tip/Nozzle Style:Chisel; Tip/Nozzle Thickness:0.1"; Tip/Nozzle Size:0.43 RoHS Compliant: Yes
   1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
KBE00S009M-D411 KBE00S009M-D4110 1Gb NAND x 2 256Mb Mobile SDRAM x 2
SPECIALTY MEMORY CIRCUIT, PBGA137
SAMSUNG SEMICONDUCTOR CO. LTD.
HY27USXXX HY27SS16121M HY27SSXXX HY27US08121M HY27 (HY27SSxxx) 512Mbit (64Mx8bit / 32Mx16bit) NAND Flash
512Mbit (64Mx8bit / 32Mx16bit) NAND Flash 512兆(64Mx8bit / 32Mx16bit)NAND闪存
Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
MB84SF6H6H6L2-70 MB84SF6H6H6L2-70PBS 3 Stacked MCP (Multi-Chip Package) FLASH & FLASH & FCRAM 128M (X16) Burst FLASH MEMORY & 128M (X16) Page/Burst Mobile FCRAM
Spansion Inc.
 
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