| PART |
Description |
Maker |
| WR-383250-17M2-G |
Please sign back specification after customer conformation until 2weeks.
|
TDK Electronics
|
| MSS50 MSS40 |
(MSS40 / MSS60) BACK TO BACK SCR MODULE
|
Comset Semiconductors
|
| S10202-08 S10202-16 S10201-04 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机，防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
|
Hamamatsu Photonics K.K.
|
| ADC1205CCJ-1 |
12-Bit Plus Sign mP Compatible A/D Converters
|
NS
|
| MAX6662 |
12-Bit Sign Temperature Sensor
|
Maxim Integrated Products
|
| MAX6634 MAX6633 MAX6633MSA MAX6635MSA MAX6634MSA M |
12-Bit Plus Sign Temperature Sensors with SMBus/I2C-Compatible Serial Interface
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
|
| AD7328 |
Software Selectable, True Bipolar Input, 8-Channel, 12-Bit Plus Sign A/D Converter
|
Analog Devices
|
| AD7324 |
Software Selectable True Bipolar Input 4-Channel 12-Bit Plus Sign A/D Converter
|
Analog Devices
|
| AD7322BRU |
Software Selectable True Bipolar Input/ 2-Channel/ 12-Bit Plus Sign ADC
|
Atmel
|
| AD7322 |
Software Selectable True Bipolar Input, 2-Channel, 12-Bit Plus Sign ADC
|
Analog Devices
|
| AD7324 |
Software Selectable True Bipolar Input, 4-Channel, 12-Bit Plus Sign A/D Converter
|
Analog Devices
|
