| PART |
Description |
Maker |
| VNC2 |
VNC2 Debug Module
|
Future Technology Devices International Ltd.
|
| V2DIP1-32 |
Designed to allow rapid development of designs using the VNC2-32Q IC
|
Future Technology Devices International Ltd.
|
| 10G-KR |
10GBASE-KR/KR4 Compliance, Debug, and Decode Solution
|
List of Unclassifed Manufacturers
|
| SX52BD SX48BD/TQ SX52BD/PQ SX48BD |
Configurable Communications Controllers with EE/Flash Program Memory, In-System Programming Capability, and On-Chip Debug
|
UBICOM
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| SX28AC SX20AC100-I_DP SX20AC100-I_PQ SX20AC100-I_S |
Configurable Communications Controllers with EE/Flash Program Memory In-System Programming Capability and On-Chip Debug
Configurable Communications Controllers with EE/Flash Program Memory, In-System Programming Capability and On-Chip Debug
|
ETC[ETC]
|
| AT91SAM7A3-14 |
High-performance 32-bit RISC Architecture
EmbeddedICE In-circuit Emulation, Debug Communication Channel Support
|
ATMEL Corporation
|
| DEBUG186 DEBUGGING |
Debugging an Am186EM Application on the SD186EM Demonstration Board Using Microsoft＇s C/C Compiler and Paradigm Debug Software Application Note 80.0KB (PDF) 调试的SD186EM演示板使用微软的C / C编译器和调试软件中的应用范例说明1 Am186EM应用程序80.0KB（PDF格式
|
AMIC Technology, Corp.
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
| HYM328020GD-60 HYM328020GD-50 |
8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 8M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
8M x 32 Bit DRAM Module (SO-DIMM)
-8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| A1SJ71UC24-R2 A1SY81 A1SJ71UC24-R4 A1SNMCA-8KP A1S |
MODULE COMMS RS232
OUTPUT CARD SINK/SOURCE 32 P
MODULE COMMS RS422
MEMORY EPROM 8K GPP
INPUT CARD SINK/SOURCE 16 P
OUTPUT CARD SINK/SOURCE 16 P
MEMORY EPROM 2K
CPU MODULE 64K
通讯科的RS232模块
路RS422模块通讯
CPU MODULE 8K CPU模块8K
REMOTE I/O MODULE 远程I / O模块
|
飞思卡尔半导体(中国)有限公司
Electronic Theatre Controls, Inc.
|
| HYM368020GS-60 HYM368020S-60 Q67100-Q985 HYM368020 |
8M x 36 Bit FPM DRAM Module with Parity
8M x 36 Bit DRAM Module with Parity
8M x 36-Bit Dynamic RAM Module 8M X 36 FAST PAGE DRAM MODULE, 60 ns, SMA72
8M x 36-Bit Dynamic RAM Module 8米36位动态随机存储器模块
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
