| PART |
Description |
Maker |
| ULSMBC-2-DV |
.079 cl Dual Row - Surface Mount Ultra Low Profile - Box Contact - Vertical
|
Major League Electronics
|
| 8110-11-202 8100-11-202 8100-11-203 8100-11-204 81 |
.079 (2mm) Dual Row Through Hole Vertical Headers 0.079(毫米)通孔垂直双行 RUBBER BOOT
|
Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
|
| 0556500788 55650-0788 |
0.50mm (.020) Pitch SlimStack Plug, Surface Mount, Dual Row, Vertical, 2.00mm (.079) Stack Height, with Solder Tab, 70 Circuits, Lead-free 0.50mm (.020) Pitch SlimStack?/a> Plug, Surface Mount, Dual Row, Vertical, 2.00mm (.079) Stack Height, with Solder Tab, 70 Circuits, Lead-free
|
Molex Electronics Ltd.
|
| TSHSCM-2-SS |
.079 cl Single Row - Surface Mount Terminal Strip Headers - Vertical
|
Major League Electronics
|
| 55959-3630 0559593630 |
2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Header, Dual Row, Right Angle, 36Circuits 2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Dual Row, Right Angle, 36Circuits 2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Dual Row, Right Angle, 36Circuits
|
Molex Electronics Ltd.
|
| TTSHSM-2-SV-S |
.079 cl Single Row - Surface Mount Thicker Terminal Strip Headers - Vertical
|
Major League Electronics
|
| 0510895005 51089-5005 |
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 50Circuits 2.00mm (.079") Pitch Mi II垄芒 System Wire-to-Board Crimp Housing, Dual Row, 50Circuits 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Dual Row, 50Circuits
|
Molex Electronics Ltd.
|
| 87569-1022 0875691022 |
2.00mm (.079) Strain Relief for Dual Row IDT, 22 circuits
|
Molex Electronics Ltd.
|
| 87569-1024 0875691024 |
2.00mm (.079) Strain Relief for Dual Row IDT, 24 circuits
|
Molex Electronics Ltd.
|
| 55917-2010 |
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Dual Row, Vertical, 20Circuits, with PCB Locator 2.00mm (.079") Pitch MicroClasp垄芒 Wire-to-Board Header, Dual Row, Vertical, 20Circuits, with PCB Locator
|
Molex Electronics Ltd.
|
|