| PART |
Description |
Maker |
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ILCX05-BB0318-20.000 ILCX05-BB1318-20.000 ILCX05-B |
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
|
ILSI America LLC
|
| ILCX20-FJ0F18-20.000 ILCX20-FJ2F18-20.000 ILCX20-F |
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
|
ILSI America LLC
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| ILCX18-GHDF18-20.000 ILCX18-BI1F18-20.000 ILCX18-B |
4 Pad Ceramic Package, 2 mm x 2.5 mm
4 Pad Ceramic Package, 2 mm x 2.5 mm
|
ILSI America LLC
|
| 920-AM-3E1-TTS 920-AM-3E1-TTS-001 |
x 7 Ceramic 6 Pad LVDS Output
|
Oscilent Corporation
|
| 921-AM-3E1-TTS 921-AM-3E1-TTS-001 |
5 x 7 Ceramic 6 Pad LVPECL Output
|
Oscilent Corporation
|
| ACT845SMX-2 |
2 pad, cost competitive ceramic packaged, glass sealed crystal.
|
Advanced Crystal Technology
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| 21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
