| PART |
Description |
Maker |
| D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818 |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
|
Harwin PLC
|
| A-70280-0280 010-87-9805 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin(Sn) PC Tail Pla
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin(Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 0010897240 010-89-7240 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 0010897220 010-89-7220 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 70280-0102 0010897440 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 70280-0103 A-70280-0103 0010897460 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 010-89-7180 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
Molex Electronics Ltd.
|
| 70247-1452 0702471452 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
| 70246-2601 0702462601 |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 26Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
Molex Electronics Ltd.
|
|
