| PART |
Description |
Maker |
| TC2996B |
1.9 GHz 12 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| TC2996D |
2.45 GHz 12 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| TC2997A |
1.6 GHz 20 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| TC2997G |
3.5 GHz 16WFlange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| ACT845SMX-2 |
2 pad, cost competitive ceramic packaged, glass sealed crystal.
|
Advanced Crystal Technology
|
| QESM05 |
SMD 5.0x3.2 Crystal - Ceramic SMD packaged
|
TEMEX
|
| QESM052 |
SMD 5.0x3.2 Crystal - Ceramic SMD 2 pads packaged 贴片5.0x3.2水晶-陶瓷贴片2垫包
|
Rakon France SAS
|
| D20NP1R4F5PA D12NP0R4F5PA D12NP0R4B5PA D15NP1R2F5P |
CAPACITOR, CERAMIC, 50 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000004 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000005 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000018 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000009 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000045 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000013 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.000001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000035 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000017 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000016 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NS, 0.000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, BJ, 0.000043 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.0000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
|
Dielectric Laboratories, Inc.
|
| PS7122A-2A PS7122A-1A PS7122AL-1A PS7122AL-1A-E4 P |
OCMOS FET
High Voltage and High Speed power MOSFET and IGBT Half Bridge Driver in a 8-pin DIP package; A IR2308 packaged in a 8-Lead SOIC
Dual Low Side Driver, Inverting Input in a 8-pin DIP package; A IR4426 packaged in a 8-Lead SOIC
1200V Half Bridge Driver IC for Power Switching Applications in a 24 Lead SSOP package; A IR2214 packaged in a Lead-Free 24 Lead SSOP
FET-OUTPUT OPTOCOUPLER
Single High Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2125 packaged in a Lead-Free 16-Lead SOIC shipped on Tape and Reel
Half Bridge Driver, Single Input Plus Inverting Shutdown Pin, Fixed 520ns Deadtime in a 8-pin DIP package; A IR2104 packaged in a Lead-Free 8-Lead PDIP
OCMOS场效应管
Optical Coupled MOS FET photocoupler(MOS 场效应管输出光光隔离器) 光纤耦合场效应晶体管光电耦合器（简称MOS场效应管输出光光隔离器
|
NEC, Corp.
|
| 0402CS-18NXJLU 0402CS-1N2XJLW 0402CS-5N1XJLU 0402C |
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0051 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 2% tol, SMT, RoHS 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0095 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.019 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.009 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 2% tol, SMT, RoHS 1 ELEMENT, 0.0043 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0043 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 2% tol, SMT, RoHS 1 ELEMENT, 0.0087 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0075 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.03 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.051 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 2% tol, SMT, RoHS 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.036 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 2% tol, SMT, RoHS 1 ELEMENT, 0.0062 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.0062 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.043 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0024 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Coilcraft, Inc.
Linear Technology, Corp.
COILCRAFT INC
|
| LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
|
MICROSEMI CORP-LOWELL
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
|
