| PART |
Description |
Maker |
| SKQYPCE010 SKQYABE010 SKQYAAE010 SKQYPAE010 SKQYAC |
6.1×3.7mm Compact High-speed Mounting(Surface Mount Type)
6.1隆驴3.7mm Compact High-speed Mounting(Surface Mount Type)
|
ALPS ELECTRIC CO.,LTD.
|
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| UDZSTE-1720B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| MSM66562 MSM66P563 |
High-speed High-performance 16-Bit Microcontroller for Compact System
|
OKI
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| KD2004-DG10A |
Compact high speed thick film thermal printhead (8dots / mm)
|
Rohm
|
| AQW214A AQW214AX AQW214AZ AQW212AZ AQW210 AQW210A |
Compact DIP8-pin type of 60V to 600V load voltage High-speed inspection machines
|
Panasonic Semiconductor
|
| EB2 |
COMPACT AND LIGHT WEIGHT SURFACE MOUNTING TYPE
|
NEC Corp.
|
| EXBD10P103J EXBE10C103J EXB-D10C103J EXB-D10C562J |
Chip Resistor Networks High speed mounting using conventional placing machine
Chip Resistor Networks High speed mounting using conventional placing machine
|
Panasonic Semiconductor
|
| SIL865970 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
