| PART |
Description |
Maker |
| 449-10-210 449-10-210-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-212 449-10-212-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-272-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 480-90-202-00-001000 480-90-264-00-001000 450-90-2 |
HEADER STRIPS .100隆卤 Grid Solder Tail Double Row
HEADER STRIPS .100 Grid Solder Tail Double Row
HEADER STRIPS .100?/a> Grid Solder Tail Double Row
TWO PART BOARD CONNECTOR
|
Mill-Max Mfg. Corp.
MILL-MAX MFG CORP
|
| 70287-1195 |
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 100 Circuits, 8.13mm
|
Molex Electronics Ltd.
|
| 0702800448 70280-0448 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.72mm (.107) PC Tail Length
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail
2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 829-22-006-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-010-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-003-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
