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3C34 - Material specification

3C34_5042397.PDF Datasheet


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MC12U256HBFA-0QC00 MC1GU032HCYA-0QC00 MC1GU016HCFB CABLE, 9505, 5PAIR, 30.5M; Cores, No. of:10; Conductor make-up:7/32AWG; Area, conductor CSA:0.2mm2; Diameter, External:7.34mm; Material, secondary insulation:PVC; Length, Reel (Imperial):100ft; Colour, secondary insulation:Chrome; RoHS Compliant: Yes
Shielded Paired Cable; Number of Conductors:2; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyvinylchloride (PVC); Shielding Material:Aluminum Foil/Polyester Tape; Number of Pairs:1 RoHS Compliant: Yes
CABLE, 9506, 6PAIR, PER M; Cores, No. of:12; Conductor make-up:7/32AWG; Area, conductor CSA:0.2mm2; Diameter, External:7.34mm; Material, secondary insulation:PVC; Colour, secondary insulation:Chrome; Alpha type number:5476C RoHS Compliant: Yes
AC MEXICO
Shielded Paired Cable; Number of Conductors:10; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyvinylchloride (PVC); Number of Pairs:5; Impedance:75ohm; Leaded Process Compatible:Yes; Voltage Nom.:300V RoHS Compliant: Yes
Film Capacitor; Capacitor Type:Motor Start/Motor Run; Voltage Rating:370VAC; Capacitor Dielectric Material:Polypropylene; Capacitance:3uF; Capacitance Tolerance: 10%; Lead Pitch:20.6mm; Leaded Process Compatible:Yes; Series:MPF RoHS Compliant: Yes
Film Capacitor; Capacitor Type:Motor Start/Motor Run; Voltage Rating:370VAC; Capacitor Dielectric Material:Polypropylene; Capacitance:4uF; Capacitance Tolerance: /- 10%; Lead Pitch:20.64mm; Package/Case:32; Series:MPF
The HFC-S mini is not recommended for new projects. Please use XHFC-1SU instead. 多媒体卡规格
MultiMediaCard Specification 多媒体卡规格
   MultiMediaCard Specification
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SAMSUNG SEMICONDUCTOR CO. LTD.
Cologne Chip
Samsung Semiconductor Co., Ltd.
XC95144XV XC95144XV-5TQ100C XC95144XV-5TQ100I DS05 From old datasheet system
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Metal Connector Backshell; Enclosure Material:Steel; Connector Type:Right-Angle; No. of Positions:25 RoHS Compliant: Yes
DB24659
   144 macrocells with 3,200 usable gates
XILINX[Xilinx, Inc]
Xilinx, Inc.
EE13-K-H-8P-SW EE13-KH-8P-SW BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
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K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费(符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费(符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
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Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
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