| PART |
Description |
Maker |
| S7171-0909 S7170-0909 |
CCD area image sensor 512 × 512 pixels, Back-thinned FFT-CCD
CCD area image sensor 512 】 512 pixels, Back-thinned FFT-CCD
|
http://
Hamamatsu Corporation
|
| S10202-08 S10202-16 S10201-04 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机，防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
|
Hamamatsu Photonics K.K.
|
| S9970 S9971-1008 S9971-0906 S9971-1006 S9970-1008 |
CCD area image sensor Low dark signal ・ low readout noise/front-illuminated FFT-CCD
|
Hamamatsu Photonics
|
| S7199-0111 |
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging
|
Hamamatsu Corporation
|
| S9737-01 S9737-02 S9737-03 S9737 |
CCD area image sensor 1024 × 1024 pixels, front-illuminated FFT-CCDs
CCD area image sensor 1024 】 1024 pixels, front-illuminated FFT-CCDs
|
Hamamatsu Corporation
|
| AUIR3241S AUIR3241STR |
high side Mosfet driver for back to back topology targeting back to back switch
|
Infineon Technologies A...
|
| TCD2558D |
IMAGE SENSOR-CCD, 5-7V, RECTANGULAR, THROUGH HOLE MOUNT
The TCD2558D is a high sensitive and low dark current 5340 elements 3 line CCD color image sensor which includes CCD drive circuit, clamp circuit.
TOSHIBA CCD Linear Image Sensor CCD (charge coupled device) 东芝防治荒漠化公约线性图像传感器CCD（电荷耦合器件
|
Toshiba Semiconductor
Toshiba, Corp.
|
| MWDM1L-GP-0E MWDM2L-GP-0E MWDM4L-GP-0E MWDM5L-GP-0 |
Micro-D Metal Shell MWDM Back-To-Back Unshielded Cable Assemblies
|
Glenair, Inc.
|
| 891-00525CST-0 891-00525CSA1-0 891-00525CSA1-2 891 |
Nanominiature Connectors Double Row Back-To-Back
|
Glenair, Inc.
|
| PDSP16510A PDSP16510AA0AC PDSP16510AA0GC PDSP16510 |
Stand Alone FFT Processor
|
Mitel Semiconductor
MITEL[Mitel Networks Corporation]
|
| PDSP16540 PDSP16510AMA PDSP16256 PDSP16330 PDSP163 |
Stand Alone FFT Processor
|
ZARLINK[Zarlink Semiconductor Inc]
|
