| PART |
Description |
Maker |
| 90-0002 |
PACKAGE LAND PATTERN, (T4055-2 / T4055 2)
|
Maxim Integrated Products
|
| 90-0179 |
PACKAGE LAND PATTERN, (U3) SOT23, 3 LEADS
|
Maxim Integrated Products
|
| 90-0096 |
PACKAGE LAND PATTERN, (S8) 0.150 SOIC, 8 LEADS
|
Maxim Integrated Products
|
| 90-0167 |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS
|
Maxim Integrated Products
|
| 90-0097 |
PACKAGE LAND PATTERN, (S16) 0.150 SOIC, 16 LEADS
|
Maxim Integrated Products
|
| 90-0112 |
PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS
|
Maxim Integrated Products
|
| 90-0028 |
PACKAGE LAND PATTERN (T2855-8 / T2855 8 / T2855MK 8)
|
Maxim Integrated Products
|
| 90-0120 |
PACKAGE LAND PATTERN, (U16E-3 / U16E 3)
|
Maxim Integrated Products
|
| 90-0119 |
PACKAGE LAND PATTERN, (U14E-3 / U14E 3)
|
Maxim Integrated Products
|
| LPF2807T-100M-C LPF2807T-2R2M-C LPF2807T-3R3M-C LP |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPS252010T-3R3M LPS252010T-6R8M LPS252010T-1R2N LP |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|