| PART |
Description |
Maker |
| 90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
| G3VM-51PR |
Smallest Class in market, USOP Package MOS FET Relays is designed to exhibit a fast rise time and reduce signal degradation.
|
Omron Electronics LLC
|
| CJSE115 |
MSOP 8L/10L Amplifier Universal Evaluation PCB (unpopulated) 积极的固定电压稳压器
|
Micron Technology, Inc.
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| TQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| WQFN6X6-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
