| PART |
Description |
Maker |
| 21-0061 |
PACKAGE OUTLINE, 10L UMAX/USOP
|
Maxim Integrated Products
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| WQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| WQFN6X6-48 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
