| PART |
Description |
Maker |
| 21-0114B 21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) 封装外形引脚薄型SOT23封装，（小资料）
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Maxim Integrated Products, Inc.
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT223-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-3 SOT323 |
Package Outline
|
Global Mixed-mode Techn...
|
| WQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
