| PART |
Description |
Maker |
| 21-0102 |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Dallas Semiconducotr
Dallas Semiconductor
|
| BIR-BN08E4G-2 |
16 Bit System Integrating A/D Processor, 16L SOIC
END-LOOK PACKAGE T EMITTING DIODE
|
Bright LED Electronics Corp.
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| BL-HA135A-TRB |
Quad N-Channel EPAD Matched Pair MOSFET Array, Vgs= 0.4 V, 16L SOIC, EPAD Enabled
Amber Mono-color type 2.0x1.25x1.0mm(0805) standard package.
|
Bright LED Electronics Corp.
|
| BL-HA134A-TRB |
Quad N-Channel EPAD Matched Pair MOSFET Array, Vgs= 0.4 V, 16L PDIP, EPAD Enabled
Amber Mono-color type 3.2x1.0x2.0mm (1204) standard package.
|
Bright LED Electronics Corp.
|
| WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220F |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
