| PART |
Description |
Maker |
| 32-6554-10 32-6552-11 42-6552-10TL |
32 PIN ZIF SOCKET, TIN DIP32, IC SOCKET
DIP42, IC SOCKET
|
TE Connectivity, Ltd.
ARIES ELECTRONICS INC
|
| 816-22-054-10-005-101 818-22-054-10-001-101 816-22 |
SIP54, IC SOCKET
DIP54, IC SOCKET
SIP36, IC SOCKET
SIP2, IC SOCKET
DIP32, IC SOCKET
SIP32, IC SOCKET
SIP29, IC SOCKET
DIP38, IC SOCKET
SIP51, IC SOCKET
SIP43, IC SOCKET
SIP5, IC SOCKET
|
MILL-MAX MFG CORP
|
| 110-99-428-41-001 110-91-636-41-001 110-99-636-41- |
DIP28, IC SOCKET
DIP36, IC SOCKET
DIP10, IC SOCKET
DIP32, IC SOCKET
DIP52, IC SOCKET
DIP64, IC SOCKET
DIP4, IC SOCKET
DIP6, IC SOCKET
DIP50, IC SOCKET
|
MILL-MAX MFG CORP
|
| ALC-632-SST ALC-314-NGT ALC-320-NGG |
DIP SOCKET CARRIER DIP32, IC SOCKET
DIP14, IC SOCKET
DIP20, IC SOCKET
|
Samtec, Inc.
SAMTEC INC
|
| ICE-326-T-CP-TT ICE-143-CP-TG ICE-143-CP-TT ICE-08 |
DIP32, IC SOCKET
DIP14, IC SOCKET
DIP8, IC SOCKET
DIP40, IC SOCKET
|
ROBINSON NUGENT INC
|
| D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818 |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
|
Harwin PLC
|
| H3490-01 |
PC Board Socket for 2.00mm Pin, gold clip tin shell BERYLLIUM COPPER, TIN (197) FINISH, PCB TERMINAL
|
Harwin PLC
|
| 614-99-432-41-001000 MILL-MAXMFGCORP-614-99-420-41 |
DIP32, IC SOCKET
|
MILL-MAX MFG CORP
|
| ICO-632-FGG-L |
DIP32, IC SOCKET
|
SAMTEC INC
|
| LS624-02TG LS318-02GG LS632-02TG HLS324-03TG HLS30 |
24 POS MOLDED DIP SOCKET DIP64, IC SOCKET
18 POS MOLDED DIP SOCKET DIP18, IC SOCKET
32 POS MOLDED DIP SOCKET DIP32, IC SOCKET
24 POS MOLDED DIP SOCKET DIP24, IC SOCKET
8 POS MOLDED DIP SOCKET DIP8, IC SOCKET
20 POS MOLDED DIP SOCKET DIP40, IC SOCKET
8 POS OPEN FRAME MOLDED DIP SOCKET
22 POS MOLDED DIP SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| 39-53-2194 39-53-2234 39-53-2044 |
1.25 FFC ZIF Hsg Assy 19Ckt 19 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
1.25 FFC ZIF Hsg Assy 23Ckt 23 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
SOCKET, FFC/FPC 1.25MM ZIF 4WAYSOCKET, FFC/FPC 1.25MM ZIF 4WAY; Ways, No. of:4; Pitch:1.25mm; Current rating:1A; Flammability rating:UL94V-0; Material, contact:Phosphor Bronze Alloy; Plating, contact:Tin-Lead; Poles, No. of:4;
|
Molex, Inc.
MOLEX INC
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
|
