| PART |
Description |
Maker |
| 70280-0043 A-70280-0043 010-89-7062 0010897062 |
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature
|
Molex Electronics Ltd.
|
| 15-80-0141 A-70567-0005 0015800141 705670005 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0109 0015800109 70567-0275 A-70567-0275 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0010897382 010-89-7382 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 38 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0010897402 010-89-7402 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0010897200 010-89-7200 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 20 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0010977426 10-97-7426 A-70280-0181 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 15-80-0103 0015800103 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical Shrouded, High Temperature, 10 Circuits
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-47-7732 0015477732 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 15-80-0585 0015800585 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0015800145 15-80-0145 70567-0141 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0015800165 15-80-0165 70567-0142 A-70567-0142 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
|
Molex Electronics Ltd.
|
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