| PART |
Description |
Maker |
| DS42515 AM29DL164D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| MB84VD23381FJ-80PBS MB84VD23381FJ MB84VD23381FJ-80 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
|
FUJITSU[Fujitsu Media Devices Limited]
|
| AM49DL640BH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM41DL32X4G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
| MB84VD2119XEM-70 MB84VD21181EM-70PBS MB84VD21182EM |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS
|
SPANSION[SPANSION]
|
| M6MGE13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM34CWG-P M6MGT64BM34CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM17AWG-P M6MGT64BM17AWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion Inc.
Spansion, Inc.
|
| AM49LV6408MT15I AM49LV4608MT15IS AM49LV4608MT15IT |
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP64兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
Stacked Multi-chip Package (MCP) 64 Mbit (4 M x 16 bit) Flash Memory and 8 Mbit (512K x 16-Bit) pseudo Static RAM 堆叠式多芯片封装（MCP4兆位个M × 16位）闪存兆位（为512k × 16位）伪静态存储器
|
Spansion, Inc.
Spansion Inc.
|
| A81L801UG-70IF A81L801 A81L801TG-70 A81L801TG-70F |
Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM
|
AMICC[AMIC Technology]
|
