| PART |
Description |
Maker |
| 21-0114B 21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) 封装外形引脚薄型SOT23封装，（小资料）
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Maxim Integrated Products, Inc.
|
| AIMB-0BRK-VM03E |
Thin Barebone System with Embedded Low Profile Mini-ITX Motherboard
|
Advantech Co., Ltd.
|
| UPA835 UPA835TC UPA835TC-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE
|
NEC Corp.
NEC[NEC]
|
| MS4 |
HIGH RELIABILITY FOR LOW COST LOW PROFILE - 2.0 MM MAX. PACKAGE HEIGHT
|
PETERMANN-TECHNIK
|
| SS12-E3 SS14-E3/5AT |
Low profile package
|
TY Semiconductor Co., Ltd
|
| CPC5600A |
low profile package and optical
|
clare
|
| ACT9200L |
MINIATURE LOW PROFILE SURFACE MOUNT PACKAGE
|
Advanced Crystal Technology
|
| SPVR110100 SPVR120100 |
Low-profile Lever Type
|
ALPS ELECTRIC CO.,LTD.
|
| SPVP |
Low-profile One-way Operation Type
|
ALPS ELECTRIC
|
