| PART |
Description |
Maker |
| P2NQ |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| IL3M-HX5F12.5-32.768 |
4 Pad Plastic Package Quartz Crystal, 3.8 mm x 8 mm
|
ILSI America LLC
|
| 21-0111 |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
|
Maxim Integrated Products
|
| J68.BPACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| ILCX18-GHDF18-20.000 ILCX18-BI1F18-20.000 ILCX18-B |
4 Pad Ceramic Package, 2 mm x 2.5 mm
4 Pad Ceramic Package, 2 mm x 2.5 mm
|
ILSI America LLC
|
| ILCX03-BG3318-20.000 ILCX03-BG0F18-20.000 ILCX03-B |
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
|
ILSI America LLC
|
| ILCX10-FF1318-20.000 ILCX10-FF1F18-20.000 ILCX10-F |
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
|
ILSI America LLC
|
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| 2SC5998YC 2SC5998 |
Octal LNA/VGA/AAF/ADC and Crosspoint Switch; Package: TQFP w/ 9.5mm exposed pad; No of Pins: 100; Temperature Range: Industrial
Silicon NPN Epitaxial High Frequency Medium Power Amplifier
|
Renesas Electronics Corporation.
RENESAS[Renesas Electronics Corporation]
|
| AD9238BCPZ-20 |
Dual 12-Bit, 20/40/65 MSPS, 3 V ADC; Package: LFCSP (9x9mm, 4.70mm exposed pad); No of Pins: 64; Temperature Range: Industrial 2-CH 12-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC64
|
Analog Devices, Inc.
|
