| PART |
Description |
Maker |
| M6MGB64BM34CWG M6MGT64BM34CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| CHF15KE10 CHF15KE10A CHF15KE12 CHF15KE12A CHF15KE1 |
FLIP CHIP TVS DIODES
Patented Flip Chip Series 专利倒装芯片系列
From old datasheet system
Transient Voltage Suppressor
FLIP CHIP TVS DIODES 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE
CAP,CERAMIC,470PF,5%,50V,BOX,0.120(3.1)HX0.100(2.5 )TX0.138(3.5)LX0.100(2.5)LSX0 倒装芯片TVS二极
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| VESD05C-FC1 |
Bidirectional ESD protection diodes
in flip-chip 1005 size;
Flip Chip Protection Diode - Chip Size 0402
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| LXT318 |
LXT318 Long-Haul E1 Transceiver Solution Migration from Dual-Chip (LXT304A/LXT316) to Single-Chip (LXT318) Implementation
|
Intel
|
| BC41B143A-DS-002PD BC41B143AXX-IXB-E4 |
BlueCore 4-ROM CSP EDR Single Chip Bluetooth v2.0 EDR System
|
ETC
|
| S2S65A30 |
One-chip solution, which can reduce system cost.
|
Epson Company
|
| BCM2035 |
BLUETOOTH SINGLE CHIP HCI SOLUTION
|
ETC
Broadcom Corporation.
|
| BCM2048 |
BLUETOOTH 2.0 EDR SINGLE-CHIP HCI SOLUTION
|
Broadcom Corporation
|
| AP9214L |
SINGLE CHIP SOLUTION FOR 1-CELL Li BATTERY PACK
|
Diodes Incorporated
|
