| PART |
Description |
Maker |
| TD2-7D00-074 TD2-7H01-074 |
Hygienic Thermatel? Thermal Dispersion Flow & Level Switch
|
Magnetrol International, Inc.
|
| 345-0442-100 344-0442-100 |
Ultrasonic Non-Contact Transmitters for Level, Volume, or Open Channel Flow
|
Magnetrol International, Inc.
|
| 335-AD1A-G5P |
Echotel? Model 335 Non-Contact Ultrasonic Transmitter for Level, Volume, or Open Channel Flow
|
Magnetrol International, Inc.
|
| 17572 17572-G |
HTSNK. B X-FLOW. .9H LOW FLOW. THRU HOLE HTSNKB型X流0.9 低流量。通孔
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| BSP78 |
Smart Lowside Power Switch (Logic Level Input Input Protection ESD Thermal shutdown with auto restart)
|
Siemens Semiconductor G...
|
| CY7C1475V33-133BGXI CY7C1475V33-133BGI CY7C1475V33 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 8.5 ns, PBGA165
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 6.5 ns, PQFP100
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture(带NoBL结构B>72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM)
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL?/a> Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL垄芒 Architecture
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
| EYP2BH145 EYP05BE115 EYP05BE101 EYP1BF145 EYP2BH11 |
Thermal Cutoffs (TCO)/ Thermal-links Small and Insulation Type High Reliability
|
Panasonic Semiconductor
|
| SE2004-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| SE2002-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
