| PART |
Description |
Maker |
| FD120H06A5B |
Fred Die
|
International Rectifier
|
| FD120W06A5B |
Fred Die
|
International Rectifier
|
| FD160H06A5B |
Fred Die in Wafer Form
|
International Rectifier
|
| DSEI12-12A DSEI1212 DSEI-12 |
Fast Recovery Epitaxial Dioder (FRED)
Fast Recovery Epitaxial Diode (FRED)
Fast Recovery Diodes
|
IXYS Corporation
|
| IRFP151 IRFP153 IRFP152 IRF150 IRF152 IRFP150 IRFC |
(IRFP150 - IRFP153) HIGH VOLTAGE POWER MOSFET DIE
(IRF150 - IRF153) HIGH VOLTAGE POWER MOSFET DIE
|
International Rectifier
IXYS[IXYS Corporation]
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
|
Infineon
|
| EC10UA40 |
FRED
|
Nihon Inter Electronics Corporation
|
| TCF10B60 |
FRED
|
Nihon Inter Electronics Cor...
|
| MF100C12F1 |
FRED Modules
|
Jiangsu APT Semiconductor Co.,Ltd
|
| APTDF100H170G |
FRED 50-1700V
|
Microsemi
|
