| PART |
Description |
Maker |
| C5750X7S2A106MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X5R0J475K C3225X7S1H106M |
TDK MLCC Capacitance Offering
|
TDK Electronics
|
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC7000 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
| MPC7450RXQXPND MPC7450RXQXPNS |
MPC7450 Part Number Specification for the XPC7450RXnnnQx Series part number specification
Part Number Specification for the XPC7450RXnnnQx Series
|
Motorola
|
| MPC755BTXPND MPC755BTXPNS XPC755BRX400TE XPC755BRX |
MPC755 Part Number Specification for the XPC755BxxnnnTx Series
Part Number Specification for the XPC755BxxnnnTx Series
|
Motorola
|
| MPC8240RZUPND MPC8240RZUPNS |
MPC8240 Part Number Specification for the XPC8240RZUnnnx Series
Part Number Specification for the XPC8240RZUnnnx Series
|
Motorola
|
