PART |
Description |
Maker |
HEDM-65XX |
Large Diameter (56mm),Housed Two and Three Channel Optical Encoders(大的直径(56mm),含有两个和三个通道的光编码
|
Agilent(Hewlett-Packard)
|
RCM7060M A5800182 |
16 characters x 2 lines transflective character module with LED backlight From old datasheet system
|
ROHM
|
BF9864A |
FSTN Transflective LCD, COF package Built-in driver PCF8548, serial I2C data bus
|
Bolymin,Inc.
|
LCM-X01602DXXF |
5.56mm CHARACTER HEIGHT
|
LUMEX INC.
|
0440671002 44067-1002 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
|
Molex Electronics Ltd.
|
44067-0403 0440670403 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
|
Molex Electronics Ltd.
|
0440671403 44067-1403 |
3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti MOLEX Connector
|
Molex Electronics Ltd.
|
44067-0201 0440670201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
44067-0802 0440670802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
|
Molex Electronics Ltd.
|
44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
44067-1802 0440671802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
|
Molex Electronics Ltd.
|
|