| PART |
Description |
Maker |
| LCM-S01602DSF-A SCM-S01602DSFA |
TRANSFLECTIVE
5.56mm CHARACTER HEIGHT, 5 x 8 DOT MATRIX, STN, TRANSFLECTIVE WITH LED BAKLIGHT, 16 x 2 LCD MODULE, 1/16 DUTY, 1/5 BIAS
|
LUMEX INC.
|
| LCM-S01602DSF-C LCM-S01602DSFC |
16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE
16x2 LCD, 5x8 DOT MATRIX, STN, TRANSFLECTIVE BACKLIGHT, 1/16 DUTY, 1/5 BIAS.
|
LUMEX INC.
|
| BF128128E |
FSTN Transflective LCD, COF package Built-in driver HD66750
|
Bolymin, Inc
|
| LCM-S01602DSF-B-Y |
5.56mm CHARACTER HEIGHT
|
LUMEX INC.
|
| LCM-S01602DXX-A |
5.56mm CHARACTER HEIGHT, 5x8 DOT MATRIX, 16x2 LCD MODULE
|
LUMEX INC.
|
| 1-2013620-3 |
PGA Sockets; SOCKET ASSY W/EMBOSS TAPE 56mm, rPGA988A ( Tyco Electronics )
|
Tyco Electronics
|
| BZ-2RW8244-A2 |
SNAP ACTING/LIMIT SWITCH, SPDT, MOMENTARY, 0.5A, 125VDC, 5.56mm, PANEL MOUNT
|
HONEYWELL SENSING AND CONTROL
|
| 35730-2900 0357302900 |
3.56mm (.140) Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138) Thickness, Wire Range 14-20 AWG (2.00-0.52mm2), Unplated
3.56mm (.140") Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138") Thickness, Wire Range 14-20 AWG (2.00-0.52mm虏), Unplated
|
Molex Electronics Ltd.
|
| 0440671401 44067-1401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1202 0440671202 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
| 0440672201 44067-2201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector
|
Molex Electronics Ltd.
|
|
