| PART |
Description |
Maker |
| B72540T3140S272 B72540T1300K062 |
Multilayer technology
|
EPCOS AG
|
| B72510T0040M062 B72510T0060M062 B72510T0080L062 B7 |
Multilayer technology
|
EPCOS[EPCOS]
|
| CT1812S95AG2 B72580T0600S172 B72580T0950S172 B7258 |
Multilayer technology MLV; Telecom Series
|
EPCOS[EPCOS]
|
| PIC18F2685-I/ML PIC18LF2685-I/SO PIC18F2685-I/P PI |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| 0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
| IRF7328PBF IRF7328PBF10 IRF7328TRPBF IRF7328PBF-15 |
Trench Technology
Trench Technology Ultra Low On-Resistance
|
International Rectifier
|
| Q67040S4722 Q67040S4724 IGP30N60T IGW30N60T |
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
LOW LOSS IGBT IN TRENCH AND FILEDSTOP TECHNOLOGY
|
INFINEON[Infineon Technologies AG]
|
| 05006-BP1R2CDU-R 05006-BP1R5CDU-R 05006-BP1R8ADU-R |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000022 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000005 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
Vishay Intertechnology, Inc.
|
| SIGC144T170R2C SIGC144T170R2C09 |
IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip
|
Infineon Technologies AG
|
| SIGC03T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
| IGB15N60T |
Low Loss IGBT in Trench and Fieldstop technology 在戴低损失和场终止IGBT技
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
|
INFINEON[Infineon Technologies AG]
|
| Q67040S4721 Q67040S4723 Q67040S4725 IGW50N60T IGB5 |
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
LOW LOSS IGBT IN TRENCH AND FIELDSTOP TECHNOLOGY
|
INFINEON[Infineon Technologies AG]
|
|
